Replacement of the Inductive Coupled Plasma-Reactive Ion Etcher (ICP-RIE) Instrument in the Nanoscale Fabrication Center (NFC)

Description:
The Nanoscale Fabrication Center (NFC) will add an updated inductive coupled plasma-reactive ion etcher (ICP-RIE) system. As common workhorses of a cleanroom, these plasma etch systems with fluorinated chemistries have many other applications, including surface modification, surface cleaning and the dry etching of many other materials that react with fluorine ions. With the critical function of dry etching Si and its dielectric compounds and the additional functions these basic plasma etch systems serve, they are critical to the cleanroom’s functionality and the research groups that use the cleanroom.

The NFC provides a research facility for microfabrication technologies, products and innovations. The NFC maintains a suite of semiconductor and microfabrication processing equipment in a cleanroom laboratory.

PRINCIPAL INVESTIGATOR:
Shrubhra Pasayat, assistant professor of electrical and computer engineering

CO-PRINCIPAL INVESTIGATOR:
Kurt Kupcho, laboratory manager of the NFC

CORE:
Nanoscale Fabrication Center (NFC)